On July 31, 2025, TANAKA PRECIOUS METAL GROUP Co., Ltd. held a press briefing to commemorate its 140th anniversary.
In its industrial business, which accounts for 70% of the company’s revenue, TANAKA is strengthening its efforts in the development of semiconductor materials, while also accelerating initiatives toward carbon neutrality.

Learn more… (EE Times Japan)

The post TANAKA Celebrates Its 140th Anniversary: “Manufacturing Is in Our DNA” – Driving Innovation in Semiconductor Materials first appeared on en.

TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. has developed an electrode catalyst for PEM electrolyzer that will prevent the risky crossover effect with a new type of technology. With this technology, hydrogen penetrates the PEM membrane and reacts with oxygen on the anode side. On June 5, 2025, the Catalyst Manufacturers Association Japan, nonprofit industry association, granted the Award of Technology 2025 to the Japanese company for the catalyst.

by Magnus Schwarz | June 17, 2025

This article was published on the hydrogen specialist portal H₂News. Further information can be found here:

Learn more…

The post PEM Electrolysis: A New Catalyst Designed for Preventing Crossover Effect first appeared on en.

Design News

Tanaka’s new Visi Fine series of precious metal materials, including platinum alloy wire, offers X-ray opacity as well as oxidation and corrosion resistance.

Incorporating radiopaque materials into parts of medical devices may help support clinicians in accurately positioning and operating those devices under X-ray guidance during endovascular catheter procedures.

Medical device design engineers may face challenges designing such devices, however, as “in the field of functional materials for medical devices, only a limited number of materials offer high X-ray opacity,” explains Yusuke Minagawa, section manager (medical device product manager) of the sales department at Tanaka Precious Metal Technologies. “Therefore, we recognize a growing need for the development of new materials to achieve further performance improvements.

＜Precious Metal Fine Wire＞

Learn more…

The post Incorporating Precious Metal Materials into Medical Devices first appeared on en.

Tanaka Precious Metal Technologies, which engages in the industrial precious metals business of Tanaka, has announced the development of the AgSn TLP sheet, a sheet-type bonding material designed for die attachment in the manufacturing of power semiconductor packages. Additionally, the AgSn TLP sheet is anticipated to serve as an alternative to thermal interface materials (TIMs – a TIM is a heat conducting material inserted between materials to dissipate unwanted heat generated in electronic devices) for large-area bonding in heat sinks, further expanding its potential applications.

Sheet Bonding Material That Allows Bonding of High-Current Large Silicon (Si) Chips

In recent years, there has been rising demand for high-current power semiconductors centered on applications such as electric vehicles, hybrid vehicles, and industrial infrastructure. As such, in the bonding of large Si chips, there are requirements for materials that can allow the bonding of large areas while guaranteeing high reliability. The AgSn TLP sheet announcement declares that it can be used for semiconductor chip bonding of up to 20 mm. Furthermore, it allows bonding at a low pressure of 3.3 MPa, contributing to the improvement of yield in semiconductor manufacturing.

Low-Temperature Bonding and High Heat Resistance Required for Power Semiconductors to Contribute to Heat Management

Semiconductor devices—including power semiconductors—require high heat resistance as high temperatures may cause failures or shorten lifespans. In addition, the primary bonding materials currently adopted in the manufacturing of power semiconductor packages generally include high-lead solder which is being replaced with other materials due to its impact on the environment (Although lead is under the scope of regulation by the RoHS Directive, use under a validity period is allowed for applications for which substitutes are not possible scientifically or technically. However, the development of substitutes is underway due to exclusion under the validity period), SAC solder (SAC solder is a solder material that contains tin, silver, and copper). which has low heat resistance, and silver (Ag) sintering agents. The heating temperature of this product is 250 °C, allowing transient liquid phase diffusion bonding. Transient liquid phase diffusion bonding, also known as TLP bonding, is a bonding method that temporarily melts and liquifies metals and such inserted in the bonding surface, then uses diffusion to bond through isothermal solidification when carrying out diffusion bonding. As the heat-resistance temperature rises to 480 °C after bonding, it has higher heat resistance than existing products. It can also be used with various types of bonded materials, as it can maintain a bonding strength of up to 50 MPa. Furthermore, this product is a lead-free bonding material, and it also features high bonding reliability that has passed heat cycle testing of 3,000 cycles.

As large-area bonding is possible, besides application as a die attachment material for power semiconductors, it is also expected to be used as an alternative to TIMs. Various materials with high thermal conductivity have been developed for semiconductor package manufacturing, but the low thermal conductivity of TIM materials has been a bottleneck in total thermal design. This product is a bonding material that allows large-area bonding of TIMs above 50 mm and has high thermal conductivity. It can be expected to contribute toward heat management in the manufacturing of semiconductor packages. 

Discover our latest contribution in the PCIM Magazine,
published by PCIM – Hub for Power Electronics.

The post AgSn TLP Sheet for Power Semiconductors first appeared on en.

Power electronics with silicon carbide (SiC) or gallium nitride (GaN) impose extreme requirements on the bonding of semiconductors and their support. Hybrid sinter paste with high thermal conductivity and improved mechanical properties enable demanding applications, for example in electromobility or mobile communication.

Materials such as SiC or GaN, ever thinner wafers, and ever higher power densities: Manufacturers of semiconductors for electromobility, mobile radio base stations, and other applications where high electric power is switched, are pushing the boundaries of what is possible. Here, a bottleneck is the paste that facilitates contact between the semiconductor and the substrate during bonding of semiconductor chips. The substrate can be printed or ceramic while in most power electronics applications, it is a metal plate. This paste ensures on the one hand that both components are bonded in a mechanically lasting manner, and on the other hand, works in such a manner that the heat from the chip is discharged outside.

Various processes using various pastes are available for bonding. Paste is spread over or printed onto the substrate, then a semiconductor chip is positioned over it. The resulting sandwich is heated in various chemical and physical processes depending on the paste. Finally, electric contact is established through wire bonding and the chip is inserted in a housing.

Processes for Chip Bonding

There are two existing processes for chip bonding: sticking and sintering.

Sticking: With paste of epoxy or other artificial resin, bonding is achieved by the sticking resin’s adhesion. However, the thermal conductivity (W/m·K) is low. It can be raised up to 50 W/m·K when metal particles such as silver particles are added to the paste. Raising the value higher is very difficult since the heat is conducted through the contact surfaces of the silver particles which are not bonded firmly as metal. The bonding process is very popular today and is suitable for logic chips with low heat generation.

Sintering: The paste contains metal powder as well as organic components such as solvent, which are removed during sintering. The paste is heated up to a temperature range between 200°C and 250°C, thereby metallically bonding the silver particles with each other and them with the substrate and chip. During sintering, the solvent is vaporized and pores are left in the silver. The heat conductivity is very high with over 200 W/m·K. This process is suitable for applications of power electronics and is predestined for semiconductor materials such as SiC and GaN which are used in high-voltage converters onboard E-vehicles or in mobile radio base stations.

Learn more…〔German site〕

The post Hybrid Sinter Paste for Chip Bonding (elektronik industrie 12/2024) first appeared on en.

Source: February 19, 2025
“Ready to catalyze shift to a hydrogen society” (The Japan Times)

As Japan’s leader in fuel cell catalysts, Tanaka is expanding production for the energy transition to greener power sources

Precious metals represent a key facet of the hydrogen society to come. Platinum-based catalysts, for example, are essential to building fuel cells — a core hydrogen technology. Tokyo-based Tanaka Precious Metal Technologies Co. has been developing fuel cell catalysts since the 1980s and is a global player in the drive to make the planet more sustainable by utilizing the unique properties of platinum and other precious metals.

Platinum-grade foresight

Founded 139 years ago during the Meiji Era (1868 to 1912), Tanaka was originally a money exchange. It then began dealing in platinum, later becoming the first in Japan to succeed in manufacturing catalytic platinum mesh. Today, Tanaka stands as a leader in precious metal products with three primary business pillars: advanced materials for industrial use, asset products such as bullion and coins, and jewelry.

Tanaka’s branches and affiliates cover countries and territories ranging from the United States and Germany to Asia, including Singapore, Malaysia, Thailand, China, South Korea and Taiwan. The company offers total solutions for bullion procurement as well as development and manufacturing, sales and recycling through its advanced technologies and international network.

A dedicated development department set up about 30 years ago led to Tanaka launching its FC Catalyst Development Center in 2013 to set up a mass production framework. In 2018, the growing call for a true hydrogen society spurred Tanaka to expand production. Next on the agenda is overseas production bases, with fuel cell electrode catalyst production due to begin in China in 2026 for the Chinese market.

• “We started out making materials for catalysts, and then moved on to developing combustion catalysts and fuel cell catalysts ourselves,” said Tanaka’s Chief Operating Officer Tomoyuki Tada, who’s been focused on fuel cell development and hydrogen since the early days.

  “Investing in the hydrogen field was at that time an adventure, but we anticipated the arrival of the hydrogen society.”

• 
  Tomoyuki Tada, COO of Tanaka Precious Metal Technologies Co.

Around the same time, Tada noted, Tanaka’s science and technology team dove into finding ways to use precious metals in cancer drugs and other pharmaceuticals. Fueled by the ambition of one day becoming a catalyst manufacturer that could “contribute something to people’s health and lives,” the company took its first step on the long journey to materials development for a hydrogen society.

Core tech with clean output

Fuel cells — formally known as polymer electrolyte fuel cells — emit only water as a byproduct, meaning their output of carbon dioxide and other pollutants is zero.

Platinum-based catalysts are crucial to PEFC performance.

“A catalyst is something that facilitates change without changing itself,” Tada explained. “PEFCs need to react at low temperatures, and to make that reaction happen, we need a highly active catalyst like platinum. While other catalyst materials — including nonmetallic ones — are being researched, their performance pales compared to that of platinum.”

What turned Tanaka into Japan’s undisputed leader in fuel cell catalysts is its platinum-ruthenium catalyst for Japanese Ene-Farm home-use fuel cells.

“This was the turning point that led to us dominating the Japanese market,” Tada said. “If we had not developed this catalyst, Ene-Farm might not have been realized. It was also the trigger that gave us the confidence to expand overseas.”

Tada explained that while all companies use platinum and carbon for fuel cell catalysts, Tanaka has a key advantage: a sophisticated technology that evenly disperses platinum onto carbon.

`We support the market`s growth in a strategic, long-
term manner, with a calm perspective. We`re a market
leader that can see the entire market`

Ahead of the game

Although other companies are catching up with Tanaka’s dispersion technology, the company has the added strength of being a pioneer.

“Customers process our catalyst, which is a nanoscale powder, into layers,” Tada said. “Since we were one step ahead in making and selling quality catalysts, their processing ‘recipes’ are tailored to the properties of our products so it would be difficult to switch to other suppliers.”

The company has succeeded in advancing its technology by connecting with global developers and openly sharing its expertise — a process now known as “open innovation.” Tanaka has openly provided its know-how to customers as well.

“I went to clients’ offices and showed them how to process the catalyst with a proper recipe so that they can experience the expected performance of the product,” Tada said. By supporting customers with product development, Tanaka was able to deepen communication, receive feedback and apply that knowledge to the improvement of its own products.

Hydrogen society trials

Sourcing hydrogen and addressing its sustainability and high costs are thorny challenges in achieving a hydrogen society, he said.

“Hydrogen is a secondary energy source,” Tada said, “and unlike fossil fuels such as oil, it needs to be made from something. And producing hydrogen using natural gas or fossil fuels as fuel, or by electrolyzing water, requires huge amounts of money and time. So does procuring hydrogen from overseas. The infrastructure, such as hydrogen stations and supplying hydrogen to them, is not there yet either.”

One issue is how to switch from “gray” hydrogen — which is derived from carbon dioxide-emitting fossil fuels — to “green” hydrogen, which is derived from renewable energy sources.

Polymer electrolyte membrane water electrolysis (PEMWE) is the simplest solution, but also one of the most expensive.

“We’re also developing electrode catalysts for PEMWE,” Tada explained. “But the process uses a precious metal called iridium, which is a limited resource and costs about ¥20,000 per gram, so we need to consider how to use it effectively.”

Tanaka is installing a 500-kilowatt fuel cell system at its main precious metal recycling business site in Shonan, Kanagawa Prefecture, to help demonstrate the potential of hydrogen energy. Scheduled to go online in 2026, the fuel cell system will be one of the largest private-use systems of its kind in Japan and generate 25% of the electricity used at the plant.

Since precious metals are scarce, recycling has long been a part of Tanaka’s DNA. The company is determined to create a resource circulation system that covers all stages from procurement and manufacturing to sales and recycling. To ensure its supply of the metals, Tanaka also plans to deepen its procurement relationships with mines.

Beyond that, Tanaka collects these metals from scrap, second-hand products and equipment and recycles them at its own plants. It also works incessantly to improve performance, durability and dispersion to reduce platinum usage and costs.

Mining for the future

When it comes to materials development and research, Tanaka keeps its eyes focused on the horizon and avoids the temptation of jumping onto industry trends and fads.

“We don’t let big stories from others sway us,” Tada said. “We support the market’s growth in a strategic, long-term manner, with a calm perspective. We can do this because we’re a market leader that can see the entire market. We also have a strong will to continue until the hydrogen society is realized.”

 “We fully understand that attainment of a hydrogen society is not easy,” Tada said. “Even if the achievement of our goal takes another 10, 20 or even 30 years, we are resolved, determined and willing to invest as much time as is necessary in research and development.”

This article is sponsored by Tanaka Precious Metal Technologies Co.
(https://tanaka-preciousmetals.com/en/)

The post Ready to catalyze shift to a hydrogen society first appeared on en.

Japanese precious metal materials manufacturer TANAKA Precious Metals has a history spanning almost 140 years and, since its establishment in 1885, has grown to become an international provider of precious metal solutions to a wide range of industries. The company’s diversified business portfolio ranges from products for the electronics, semiconductor and automotive industries to the supply of precious metals in the form of jewelry and resources. J-BIG spoke to Shingo Suzuki, Managing Director of TANAKA Kikinzoku International (Europe) GmbH, and Natalie Abe, General Manager of the Corporate Communications & Advertising Department of TANAKA Holdings Co., Ltd. (THD), about how the company became an expert in precious metal solutions, its entry into the European market, the workflow between Germany and Japan and its future plans.

Learn more…

The post “We continually pursue the opportunities inherent in precious metals.” (J-BIG – Japan Business in Germany”) first appeared on en.

TANAKA Precious Metals Group
TANAKA Electronics Co., Ltd.
Officer General Manager, R&D Supervisory Department
Doctor (Engineering)

Tsutomu Yamashita

TANAKA Precious Metals Group
TANAKA Precious Metal Technologies Co., Ltd.
Global Marketing/R&D Supervisory Department
General Manager, Chemical Materials Development Department

Hirofumi Nakagawa

From the perspective of strengthening industrial competitiveness and economic security, semiconductors have become strategic goods for all countries and regions. DX and GX, which aim for a prosperous and sustainable society, are also based on semiconductor innovation.

Semiconductors encompass a diversity of applications, generations, and varieties. Although most people focus on cutting-edge chips, electrical and electronic devices are equipped with many different types of chips, all of which play essential roles. The shortage of semiconductors caused by the COVID-19 pandemic remains a fresh memory, resulting in a delayed procurement of semiconductors, and plants in the automobile and other industries came to a halt.

The TANAKA Precious Metals Group has been developing and supplying materials, focusing on precious metals (platinum, gold, silver, ruthenium, palladium, etc.) used in manufacturing semiconductors and electronic parts. The Group also handles some copper and aluminum products by applying these technologies. In addition to bonding wires and precursors, the Group offers a broad lineup of products for semiconductors, such as silver adhesive pastes, active brazing filler materials, plating, and sputtering targets, which are used in all areas from general-purpose to cutting-edge chips.

NEXT ≫ Taking on the stable supply of rare materials

The post TANAKA Precious Metals Group Supporting the miniaturization of chip wiring and promoting recycling From general-purpose to cutting-edge chips, the future of semiconductors is supported by precious metals first appeared on en.

Chengbin Jin and Xinyong Tao, both with Zhejiang University of Technology, in China, have published a Perspective piece in the same journal issue outlining the work done by the team.

It is common knowledge that lithium-ion batteries do not last very long. After multiple charge/recharge cycles, the batteries begin to hold less and less charge until they become of little use and replacement becomes necessary. Because of that, some battery makers have begun to look into the possibility of using silicon anodes.

This idea may grow in popularity since the team at Stanford has found that for some types of Li-ion batteries, giving them a five-minute burst of electricity directly to the anode can restore some capacity.

Batteries that have a silicon anode have a higher density than those made using other materials, which increases their capacity. Unfortunately, upon use, some of the silicon begins to fragment, which reduces capacity. This is because the fragmenting creates isolated chunks of silicon that are partly filled with lithium—they are like little islands, unusable for holding charge.

In this new study, the research team found that applying electricity directly to the anode pulled some of the isolated chunks back to the anode, making them able to hold a charge again. After testing anode charging, the researchers tested batteries that had pure silicon anodes. Applying electricity directly to their anodes led to some degree of restored capacity.

During their experiments, the researchers found that the more electricity they applied, the more capacity was restored, but there was a limit. Too much electricity led to degradation of the electrolyte. They also found that varying the length of time that voltage was applied had an impact on restoration of capacity. Eventually, they found that applying four volts for five minutes gave the best result—a 30% increase in capacity.

More information: Yufei Yang et al, Capacity recovery by transient voltage pulse in silicon-anode batteries, Science (2024). DOI: 10.1126/science.adn1749
Chengbin Jin et al, Electric pulses rejuvenate batteries, Science (2024). DOI: 10.1126/science.ads9691

※Top Image: SEM images of the Si electrode and Li metal electrode after the 4V5s pulse at the 20th cycle, showing no sign of Li metal plating on both the Si and Li metal. Credit: Science (2024). DOI: 10.1126/science.adn1749

This article was written by Bob Yirka from Tech Xplore and was legally licensed through the DiveMarketplace by Industry Dive. Please direct all licensing questions to legal@industrydive.com.

The post Short duration voltage application to silicon anodes shows potential for restoring Li-Si battery capacity first appeared on en.

With heating and cooling accounting for nearly half of the global energy demand, their environmental impact is substantial, particularly in contributing to global warming and air pollution. To address this, devices that leverage solar absorption and radiative cooling have been explored as sustainable alternatives. However, many current systems are limited in function, offering only heating or cooling, and most large-scale implementations lack flexibility.

Professor Kim’s team has tackled these limitations with the “3D Smart Energy Device,” designed to enable both heating and cooling in a single structure. The device functions through an innovative mechanism: when its 3D structure is opened via a mechanical peeling technique, a lower layer composed of silicone elastomer and silver is revealed, facilitating radiative cooling. Conversely, when the structure closes, a black-painted surface captures solar heat, creating a heating effect.

Extensive testing on a variety of substrates – including skin, glass, steel, aluminum, copper, and polyimide – demonstrated the device’s adaptable thermal properties. By adjusting the 3D structure’s angle, the team successfully controlled the device’s heating and cooling performance, marking a promising step toward energy-efficient solutions for climate control in buildings and electronic devices on various scales.

“We are honored to have our research selected for the cover article of such a prestigious journal,” said Professor Bonghoon Kim. “We aim to ensure that these findings are applied in industrial and building settings to help reduce energy consumption.”

Research Report:Reversible Solar Heating and Radiative Cooling Devices via Mechanically Guided Assembly of 3D Macro/Microstructures

This article was written by SpaceDaily.com from SpaceDaily.com and was legally licensed through the DiveMarketplace by Industry Dive. Please direct all licensing questions to legal@industrydive.com.

The post Developing 3D smart energy devices with radiant cooling and solar absorption first appeared on en.